Datacon 2200 Evo Manual Pdf Kenya !!link!! May 2026

Overview

The Datacon 2200 EVO is a high-performance, multi-functional data logger and telemetry device designed for various industrial and commercial applications. It's a popular choice in Kenya and other parts of Africa due to its reliability, flexibility, and cost-effectiveness.

Key Features

  1. Multi-Protocol Support: The Datacon 2200 EVO supports multiple communication protocols, including Modbus, DModbus, ASCII, and others, allowing seamless integration with various devices and systems.
  2. High-Speed Data Logging: The device can log data at speeds of up to 1000 samples per second, making it ideal for applications requiring high-resolution data acquisition.
  3. Large Storage Capacity: The Datacon 2200 EVO has a large storage capacity, allowing users to store up to 1 million data points, which can be expanded using external memory devices.
  4. Analog and Digital Inputs: The device features multiple analog and digital inputs, enabling users to connect a variety of sensors and transmitters, such as temperature, pressure, flow, and level sensors.
  5. Universal Power Supply: The Datacon 2200 EVO has a universal power supply, supporting a wide range of input voltages (10-30VDC), making it suitable for use in various environments.
  6. Ethernet and Serial Communication: The device features Ethernet and serial communication interfaces, allowing users to easily connect to networks, PCs, and other devices.
  7. Advanced Data Analysis: The device comes with built-in data analysis tools, enabling users to perform calculations, scaling, and data conversion.
  8. Robust Enclosure: The Datacon 2200 EVO has a durable, IP67-rated enclosure, designed to withstand harsh industrial environments.

Technical Specifications

  • Processor: 32-bit ARM Cortex-M4
  • Memory: 256 MB RAM, 1 GB flash
  • Storage: Up to 1 million data points
  • Communication: Ethernet, serial (RS232, RS485), USB
  • Inputs: 8 analog, 8 digital
  • Outputs: 2 analog, 2 digital
  • Power Supply: 10-30VDC, 5W
  • Operating Temperature: -20°C to 60°C (-4°F to 140°F)
  • Humidity: 0-90% RH, non-condensing

Manual PDF Availability

You can download the Datacon 2200 EVO manual PDF from the manufacturer's website or through online repositories. Some popular websites to find the manual include:

The DataCon 2200 EVO is likely a data center or server-related product, given the "DataCon" name. If you're seeking a manual or specifications for this product, I can offer some general guidance:

  1. Manufacturer's Website: The best place to start is usually the manufacturer's official website. Look for the "Support" or "Downloads" section, where you might find manuals, datasheets, or firmware updates for the DataCon 2200 EVO.

  2. Online Forums and Communities: Websites like Reddit, ServerFault, or DataCenter Knowledge forums might have discussions or posts about the DataCon 2200 EVO. Users often share manuals, experiences, or point to where these documents can be found.

  3. Document Search Engines: Utilize document search engines or databases like ManualsLib, ManualsOnline, or even Google's advanced search feature to look for the specific manual.

  4. Local Distributors in Kenya: If the product is available in Kenya, local distributors or resellers might have more specific information or the manual you're looking for. Their websites or customer service could be a valuable resource.

  5. Product Review Sites: For reviews, consider tech news websites, data center equipment review platforms, or IT equipment comparison sites. These might offer insights into the product's performance, though specific reviews of the DataCon 2200 EVO might be scarce. datacon 2200 evo manual pdf kenya

If you have any more details about the product, such as its application (data center, server, storage), or if there are specific aspects you're interested in (performance, features), I can try to offer more targeted advice or information.

Datacon 2200 evo is a high-accuracy, multi-chip die bonder developed by BE Semiconductor Industries (Besi)

for advanced packaging applications, including MCM, SiP, and flip-chip

. Technical documentation and manuals for this platform typically detail its modular architecture and precision capabilities, which are essential for high-end semiconductor manufacturing. Machine Overview & Core Performance Datacon 2200 evo

is engineered for versatility, allowing manufacturers to combine die attach and flip-chip processes on a single platform Placement Accuracy : Standard models achieve an accuracy of at 3 sigma. Higher precision variants, such as the Datacon 2200 evo advanced , push this further to for ultra-fine-pitch applications. Throughput : The machine can reach speeds of up to 7,000 units per hour (UPH) per module, depending on the specific application. Component Handling : It manages components as thin as and supports wafers up to Key Features & Capabilities

Manuals for the 2200 evo describe a range of modular features that support complex assembly: Multi-Chip Capability : It can handle up to 14 different pickup tools

and 5 eject tools, enabling single-pass production for complex multi-module devices. Advanced Dispensing

: Includes options for pressure/time, auger, and piezo jetter valves to accommodate various epoxy and adhesive viscosities. Bonding Technology

: Supports thermo-compression bonding (TCB), laser-assisted bonding (LAB), and epoxy writing or stamping. Vision System

: Utilizes a high-resolution, multi-camera system for real-time image processing and alignment compensation. Variants of the Datacon 2200 evo

The platform is available in several specialized configurations: Datacon 2200 evo plus Overview The Datacon 2200 EVO is a high-performance,

: Features a tried-and-tested platform with enhanced bonding accuracy and a lower cost of ownership. Datacon 2200 evo hF

: Designed for power modules and IGBTs, offering an increased bond force of up to Datacon 2200 evo advanced

: Focused on mass production for photonics and 3D ICs with its high-speed controller and vision systems. Accessing the Manual

Official technical manuals are generally provided directly by Besi to customers through their customer support portal

The official technical documentation for the Besi Datacon 2200 evo, including operating manuals and specialized guides, is primarily hosted on the Besi Customer Area

. Access to these comprehensive PDF manuals typically requires a personal login provided by Besi Customer Support. Available Manuals & Documentation Operating Manuals & SIS

: The Service Information System (SIS) on the Besi Webshop provides machine-specific catalogs and technical documents for units manufactured after 2020. SECS/GEM Interface Manual : A specialized SECS/GEM 6.2 Evo Manual is available on for users configuring host computer communication. Technical Brochures : Detailed product specifications for the Datacon 2200 evo advanced

and other variants are available as direct PDF downloads on the Besi product pages. Key Technical Specifications Standard 2200 evo Evo Advanced Placement Accuracy Bond Force 0.05 cap N (closed loop) Wafer Size UPH (Die Attach) Focused on high-end SiP/Hybrid Support & Local Availability (Kenya)

As the Datacon 2200 evo is a high-precision semiconductor assembly tool, direct local physical manuals in Kenya are rarely distributed outside of corporate semiconductor manufacturing environments. Digital Access Besi Option Manager to manage machine features via a valid dongle/key.

: For users in Kenya, technical support and manual requests should be directed to Besi Sales & Service or finding a specific spare parts catalog for your machine? Datacon 2200 evo advanced - Product details | Besi

Downloads. Datacon 2200 evo advanced - brochure 2023.pdf. PDF - 4 MB. Customer Area | Besi Multi-Protocol Support : The Datacon 2200 EVO supports

The Datacon 2200 evo is a high-accuracy multi-chip die bonder manufactured by Besi (BE Semiconductor Industries). Finding a comprehensive PDF manual online can be difficult because these technical documents are typically proprietary and restricted to registered customers [14]. How to Access the Official Manual To obtain the complete technical guide or manual for the Datacon 2200 evo , Besi provides a dedicated Customer Area.

Besi Webshop & Service Information System: You can access machine catalogs, including 2D/3D images and technical documents, through the Besi Webshop.

Customer Support: Access to specific Datacon equipment manuals requires a personal login and password assigned by Besi Customer Support.

Older Machines: If your machine was produced before 2020, there is a separate existing catalog available in the same customer area [14]. Key Technical Specifications If you are looking for general operational information, the Datacon 2200 evo is known for these features:

Flexibility: Supports die attach, flip chip, and multi-chip applications [1, 4].

Accuracy: Features ±10 µm @ 3s accuracy, with "advanced" models offering up to 3µm [10, 11].

Handling: Equipped with 12” wafer handling and automatic tool changers [1].

Output: High-performance speeds up to 7,000 Units Per Hour (UPH) [4]. Support in Kenya

While Besi is a global company based in the Netherlands, they operate through regional offices and authorized distributors. For localized support in Kenya:

Contact Besi's global sales and service network to find the nearest authorized representative for East Africa.

Industrial equipment manuals for such specialized machinery are rarely found on local Kenyan public domains; they must be requested directly from the manufacturer for compliance and safety.

5. Troubleshooting & Error Codes (Appendix)

The manual’s appendix lists every error code (e.g., "E-421: Bond head Z-axis timeout"). For Kenyan technicians without remote support, this section is a lifeline. It provides a flowchart to diagnose hardware vs. software issues.

Frequently Asked Questions (Kenya-Specific)

Where to Get the Manual Legally in Kenya

For Kenyan businesses, sustainability is key. Here is how to legitimately obtain the PDF:

  1. Check with Regional Distributors: Contact companies like SMT Technologies or Cetronic RSA (which serves East Africa). Often, if you purchased the machine through an African reseller, they can provide the English PDF on request.
  2. ASM Customer Portal: If your company has a support agreement, request portal access. Manuals are available as high-resolution PDFs complete with bookmarks.
  3. Engineering Collaboration: Join East African electronics manufacturing groups on LinkedIn or WhatsApp. Often, a fellow engineer at another Kenyan firm—such as those in the EPZ (Export Processing Zones)—already has a copy and can share under non-disclosure.